Quad-port USB 3.0 AF connector. 1.8A power delivery per port.
High-density hub with SUS shell. Supports simultaneous data/power transfer.
Shenzhen Gaorunxin Technology Co., Ltd
Forked pins with locking clip. 6.15mm height, 30V DC rating.
Triple-layer stackable design. Front-accessible Type-C ports.
Double-to-single layer conversion with raised base. 30V DC, 100V dielectric strength.
Straight-pin DIP design. Brass/SUS shell, 1.5A current rating.
0.5mm mount height, forward orientation. SUS shell.
Three-layer stacked design. Fog-tin plated contacts.
Front-stackable design. Raised single layer, 10Gbps speed.
12.80mm pitch, 90 Degree double-layer design. 30V DC, 100V withstand voltage.
Unrolled-edge reverse orientation. 1.8A/0.25A contact configuration.