4.14mm height, reverse-mount design. No flange, brass shell.
On-board connector with 100V withstand voltage. Suitable for PCB surface mounting.
Shenzhen Gaorunxin Technology Co., Ltd
Hybrid USB 3.0 + Type-C. 90 Degree orientation, nickel-plated SUS.
180 Degree hybrid design. Copper alloy contacts, brass shell.
Rolled-edge, forked pins. Brass shell, 30V rating.
GEN2 protocol. 90 Degree bent pins, nickel-plated SUS.
Triple-layer 90 Degree design with bent pins. 1.5A current rating, UL94-V0 compliant.
Rolled-edge forward design. Selective gold/tin plating on contacts.
Four-layer architecture. SUS shell with fog-tin plating.
Three-layer stacked design. Fog-tin plated contacts.
2.80mm mount height. Forward bent-pin design.
90 Degree double-layer design with 4 pins. 1.5A current, 30V DC, UL94-V0 housing.