0.36mm mount height, reverse orientation. U2/U3 contacts.
Micro-height connector for thin devices. BRASS contacts with selective plating.
Shenzhen Gaorunxin Technology Co., Ltd
90 Degree double-layer design with 4 pins. 1.5A current, 30V DC, UL94-V0 housing.
GEN2 protocol support. Straight pins, SUS shell.
4.31mm mount depth. SUS shell with nickel plating.
Dual Type-C ports. 180 Degree orientation, brass shell.
9.50mm raised base. Nickel-plated brass shell.
Four-layer architecture. SUS shell with fog-tin plating.
19.64mm length, rolled-edge + bent pins. Nickel-plated SUS.
Unrolled-edge reverse orientation. 1.8A/0.25A contact configuration.
Rolled-edge forward design. Selective gold/tin plating on contacts.
Unrolled-edge forward fork pins. SUS shell with nickel plating.