4.31mm board-mount depth. Forward orientation, bent pins.
High-clearance connector for stacked PCB designs. 1.8A power delivery.
Shenzhen Gaorunxin Technology Co., Ltd
180 Degree locking design. Brass shell, 30V rating, -55 Degree C to 85 Degree C range.
Triple-layer 90 Degree design with bent pins. 1.5A current rating, UL94-V0 compliant.
2.63mm board-mount height, reverse orientation. 30V DC, 100M?? insulation.
19.64mm length, rolled-edge + forked pins. 30V DC rating.
GEN2 protocol. 90 Degree bent pins, nickel-plated SUS.
90 Degree dual Type-C ports. SUS shell, nickel plating.
Unrolled-edge forward fork pins. SUS shell with nickel plating.
Triple-layer fork-pin design. 1.5A current, 30m ohm contact resistance.
GEN2 protocol, straight pins. Nickel-plated SUS shell.
Triple-layer stackable design. Front-accessible Type-C ports.