4.31mm board-mount depth. Forward orientation, bent pins.
High-clearance connector for stacked PCB designs. 1.8A power delivery.
Shenzhen Gaorunxin Technology Co., Ltd
Front-stackable design. Raised single layer, 10Gbps speed.
Dual-protocol integration. PBT+LCP housing, 30V rating.
6.15mm height with locking clip. SK7 shell, 30V rating.
Type-B female port. 90 Degree bent pins, PBT housing.
Triple-layer stackable design. Front-accessible Type-C ports.
2.80mm board-mount height. Reverse bent-pin design.
Vertical SMT, unrolled-edge. SPCC shell, 30V DC.
GEN2 protocol. 90 Degree bent pins, nickel-plated SUS.
180 Degree locking mechanism. 1.8A power delivery, SUS shell.
Reverse-mount double-layer design. 30V DC, 100V dielectric strength.