FM13UF0051E FMSH ISO 18000 Smart Card IC Wafer
FM13UF0051E FMSH ISO 18000 Smart Card IC Wafer

FM13UF0051E FMSH ISO 18000 Smart Card IC Wafer

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pFM13UF0051E FMSH ISO 18000 Smart Card IC Wafer — ISO 18000./p
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    At a Glance
    • ISO 18000 compliant
    • 352 bits user memory
    • wafer package
    • Contactless Interface NVM Memory Security Features Features

    The FMSH FM13UF0051E is a security ic supporting ISO 18000, supplied in wafer.

    Key Specifications

    Memory Capacity352 bits
    Supported StandardISO 18000
    Card InterfaceContactless(single antenna)
    Packagewafer
    Typical Applicationwafer

    Features

    • Contactless Interface NVM Memory Security Features Features
    • FUNCTION BLOCK DIAGRAM Pin Informatio

    Applications

    wafer.

    Design Notes

    • Contactless parts need a tuned antenna. Read range and current draw both depend on the coil geometry and the Q of the matching network, so treat the datasheet distance figure as a reference design value, not a guarantee.
    • Where the part supports both contact and contactless operation, the two interfaces share the same die and power domain. Plan the supply so a contact transaction does not brown out the RF field.
    • Check the card-side standard before selecting: ISO 14443 A and B differ at the air interface, and a reader built for one will not talk to cards of the other.
    • EEPROM endurance and retention are specified per the datasheet. If the application rewrites counters frequently, budget the write cycles against card lifetime.

    Common Questions

    What standard does this chip support?

    ISO 18000. Matching the card-side standard is the first selection step — a reader built for one variant will not interoperate with cards of the other.

    How is it connected to a host controller?

    Through the host interface listed in the specifications above. The bus runs at pad voltage, so level shifting is not needed when the MCU shares the same rail.

    Does it include the security algorithm in hardware?

    Yes — the algorithm engine is on-die, which is why the key never leaves the chip.

    What package is it available in?

    wafer. The datasheet mechanical drawing gives the land pattern and the clearance needed around the antenna pins.

    Shenzhen Gaorunxin Technology Co., Ltd

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