Unrolled-edge forward fork pins. SUS shell with nickel plating.
Low-impedance (30m ohm) connector. 100V withstand voltage for harsh environments.
Shenzhen Gaorunxin Technology Co., Ltd
Double-to-single layer conversion with raised base. 30V DC, 100V dielectric strength.
Dual-protocol integration. PBT+LCP housing, 30V rating.
7A high-current, IP-rated. 16-pin Type-C, -40Degree C to 125Degree C.
Dual Type-C ports. 180 Degree orientation, brass shell.
Raised double-layer 10G design. 1.8A power delivery.
Reverse-mount double-layer design. 30V DC, 100V dielectric strength.
6.26mm height, straight pins. Copper alloy contacts.
IP-rated vertical Type-C. SUS shell, nickel plating.
Rolled-edge, forked pins. Brass shell, 30V rating.
Double-to-single layer conversion. Raised base for thermal management.