Full-surface SMT design. Nickel-plated brass shell.
Lead-free connector compatible with reflow soldering. RoHS compliant.
Shenzhen Gaorunxin Technology Co., Ltd
Straight pins, flat-edge design. 10Gbps data transfer.
Three-layer stacked design. Fog-tin plated contacts.
Reverse-mount double-layer design. 30V DC, 100V dielectric strength.
Rolled-edge, forked pins. Brass shell, 30V rating.
GEN2 protocol support. Straight pins, SUS shell.
180 Degree locking mechanism. 1.8A power delivery, SUS shell.
Long-body side-mount with bent pins. 30V DC, UL94-V0 housing.
2.80mm board-mount height. Reverse bent-pin design.
GEN2 protocol. 90 Degree bent pins, nickel-plated SUS.
Triple-layer stackable design. Front-accessible Type-C ports.