M2CZ02T30ALJ15 CR Micro 30V 0.2A Schottky Barrier Diode Die
- Product Details
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- 30 V / 0.2 A, Die package
- VF 0.52 V max, 0.43 V typ
- Reverse leakage 80 µA max
- planer SBD construction
The CR Micro M2CZ02T30ALJ15 is a 30 V 0.2 A Schottky barrier diode in a Die package, planer SBD construction. forward drop 0.52 V maximum, reverse leakage 80 µA, surge rating 0.6 A.
Key Specifications
| Peak Repetitive Reverse Voltage (VRRM) | 30 V |
| VRRM typ. | 45 V |
| Average Forward Current (IF) | 0.2 A |
| Forward Voltage max. (VF) | 0.52 V |
| Forward Voltage typ. (VF) | 0.43 V |
| Reverse Leakage max. (IR) | 80 µA |
| Reverse Leakage typ. (IR) | 20 µA |
| Surge Forward Current (IFSM) | 0.6 A |
| Operating Junction Temperature (Tj) | 125 °C |
| Diode Type | planer SBD |
| Package | Die |
Applications
Low-voltage DC-DC converters, load switches, battery protection, and brushed or stepper motor drive.
Selection Notes
- VRRM is the peak repetitive rating, not a DC limit. Leave margin for ringing on the cathode.
- Trench Schottky parts trade leakage for forward drop. At high junction temperature the reverse leakage climbs sharply, so check the derating curve before using one in a high-ambient design.
- VF is quoted at a specified forward current. At lower currents the drop falls, which matters in low-load efficiency measurements.
- Where trr is not listed the part is a pure Schottky with no reverse recovery charge — confirm this on the datasheet before relying on it in a hard-switched leg.
Common Questions
What is the reverse voltage rating of the M2CZ02T30ALJ15?
VRRM is 30 V, 45 V typical.
What is the forward voltage drop of the M2CZ02T30ALJ15?
VF is 0.52 V maximum and 0.43 V typical.
Does the M2CZ02T30ALJ15 have reverse recovery?
No trr figure is published for this part. It is a Schottky barrier diode, so conduction is majority-carrier and there is no minority-carrier recovery charge to account for.
What package does the M2CZ02T30ALJ15 come in?
Die. Check the datasheet mechanical drawing for lead spacing and thermal pad dimensions before laying out the footprint.
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