Double-to-single layer conversion. Raised base for thermal management.
Space-optimized connector with BRASS contacts. 30m ohm contact resistance.
Shenzhen Gaorunxin Technology Co., Ltd
Rolled-edge + forked pins. Support feet, brass shell.
14.8mm height. Phosphor bronze contacts, brass shell.
GEN2 protocol. 90 Degree bent pins, nickel-plated SUS.
GEN2 protocol, 3.40mm height. Forward bent-pin design.
GEN2 protocol support. Straight pins, SUS shell.
2.63mm board-mount height, reverse orientation. 30V DC, 100M?? insulation.
4.14mm height, reverse-mount design. No flange, brass shell.
19.64mm length, straight-edge + forked pins. SUS shell.
6.26mm height, straight pins. Copper alloy contacts.
Raised double-layer design. HDMI + USB 3.1 integration.