Double-to-single layer conversion. Raised base for thermal management.
Space-optimized connector with BRASS contacts. 30m ohm contact resistance.
Shenzhen Gaorunxin Technology Co., Ltd
GEN2 protocol, 3.40mm height. Forward bent-pin design.
14.80mm height, rolled-edge. Copper alloy contacts.
GEN2 protocol, straight pins. Nickel-plated SUS shell.
Quad-port USB 3.0 AF connector. 1.8A power delivery per port.
Two-tone housing. 90 Degree bent pins, U2/U3 protocol support.
Rolled-edge reverse fork pins. U2/U3 contacts with selective plating.
Type-B female port. 90 Degree orientation, copper alloy contacts.
9.50mm raised base. Nickel-plated brass shell.
Triple-layer fork-pin design. 1.5A current, 30m ohm contact resistance.
Double-to-single layer conversion with raised base. 30V DC, 100V dielectric strength.