2xU2 upper + 2xU3 lower layers. Fog-tin plated SUS shell.
Multi-protocol connector with 100M ohm insulation. Backward compatible with USB 2.0/3.0.
Shenzhen Gaorunxin Technology Co., Ltd
Hybrid USB 3.0 + Type-C. 90 Degree orientation, nickel-plated SUS.
3.36mm height, straight-pin forward mount. 30m?? contact resistance.
IP67-rated 180 Degree design. Copper alloy contacts, brass shell.
Dual-protocol integration. PBT+LCP housing, 30V rating.
Unrolled-edge reverse orientation. 1.8A/0.25A contact configuration.
IP-rated vertical Type-C. SUS shell, nickel plating.
GEN2 protocol, 3.40mm height. Forward bent-pin design.
Reverse-mount double-layer design. 30V DC, 100V dielectric strength.
Quad-port USB 3.0 AF connector. 1.8A power delivery per port.
Vertical SMT, unrolled-edge. SPCC shell, 30V DC.