9.50mm raised base. Nickel-plated brass shell.
Elevated connector for thermal management. 1.8A power delivery.
Shenzhen Gaorunxin Technology Co., Ltd
2.63mm board-mount height, reverse orientation. 30V DC, 100M?? insulation.
180 Degree locking design. Brass shell, 30V rating, -55 Degree C to 85 Degree C range.
0.36mm mount height, reverse orientation. U2/U3 contacts.
GEN2 protocol, 3.40mm height. Forward bent-pin design.
19.64mm length, rolled-edge + bent pins. Nickel-plated SUS.
Raised double-layer 10G design. 1.8A power delivery.
Unrolled-edge forward fork pins. SUS shell with nickel plating.
4.14mm height, reverse-mount design. No flange, brass shell.
Rolled-edge + forked pins. Support-free design.
Rolled-edge forward design. Selective gold/tin plating on contacts.