2.63mm board-mount height, reverse orientation. 30V DC, 100M?? insulation.
Low-profile connector with SK7 shell. Ideal for space-constrained applications.
Shenzhen Gaorunxin Technology Co., Ltd
90 Degree dual Type-C ports. SUS shell, nickel plating.
GEN2 protocol. 90 Degree bent pins, nickel-plated SUS.
2.80mm mount height. Forward bent-pin design.
Three-port stacked design. Non-spring contacts, DIP termination.
Three-layer stacked design. Fog-tin plated contacts.
90 Degree double-layer design with 4 pins. 1.5A current, 30V DC, UL94-V0 housing.
GEN2 protocol, straight pins. Nickel-plated SUS shell.
19.64mm length, rolled-edge + bent pins. Nickel-plated SUS.
Front-stackable design. Raised single layer, 10Gbps speed.
Rolled-edge + forked pins. Support-free design.