2.80mm board-mount height. Reverse bent-pin design.
Low-profile connector with 1.8A power delivery. 100V withstand voltage.
Shenzhen Gaorunxin Technology Co., Ltd
Four-layer architecture. SUS shell with fog-tin plating.
Front-stackable design. Raised single layer, 10Gbps speed.
13.70mm height. Nickel-plated brass shell.
Triple-layer 90 Degree design with bent pins. 1.5A current rating, UL94-V0 compliant.
Vertical SMT, unrolled-edge. SPCC shell, 30V DC.
GEN2 protocol. 90 Degree bent pins, nickel-plated SUS.
3.36mm height, straight-pin forward mount. 30m?? contact resistance.
Rolled-edge reverse fork pins. U2/U3 contacts with selective plating.
Three-layer stacked design. Fog-tin plated contacts.
9.50mm raised base. Nickel-plated brass shell.