2.80mm board-mount height. Reverse bent-pin design.
Low-profile connector with 1.8A power delivery. 100V withstand voltage.
Shenzhen Gaorunxin Technology Co., Ltd
Raised double-layer 10G design. 1.8A power delivery.
Unrolled-edge forward fork pins. SUS shell with nickel plating.
Full-surface SMT design. Nickel-plated brass shell.
GEN2 protocol. 90 Degree bent pins, nickel-plated SUS.
GEN2 protocol, straight pins. Nickel-plated SUS shell.
IP67-rated 180 Degree design. Copper alloy contacts, brass shell.
2.63mm board-mount height, reverse orientation. 30V DC, 100M?? insulation.
6.26mm height, straight pins. Copper alloy contacts.
4.31mm mount depth. SUS shell with nickel plating.
Three-layer stacked design. Fog-tin plated contacts.