Front-stackable design. Raised single layer, 10Gbps speed.
Modular Type-C connector with fog-tin plating. 30V DC/100V AC ratings.
Shenzhen Gaorunxin Technology Co., Ltd
Straight-pin DIP design. Brass/SUS shell, 1.5A current rating.
GEN2 protocol, 3.40mm height. Forward bent-pin design.
GEN2 protocol support. Straight pins, SUS shell.
Type-B female port. 90 Degree bent pins, PBT housing.
Three-layer stacked design. Fog-tin plated contacts.
Rolled-edge + forked pins. Support-free design.
180 Degree hybrid design. Copper alloy contacts, brass shell.
2.80mm mount height. Forward bent-pin design.
90 Degree bent-pin termination. PBT/UL94-V0 housing.
14.8mm height. Phosphor bronze contacts, brass shell.