Triple-layer stackable design. Front-accessible Type-C ports.
High-density connector with BRASS contacts. Supports 10Gbps data transfer.
Shenzhen Gaorunxin Technology Co., Ltd
90 Degree double-layer design with 4 pins. 1.5A current, 30V DC, UL94-V0 housing.
Type-B female port. 90 Degree orientation, copper alloy contacts.
Vertical SMT, unrolled-edge. SPCC shell, 30V DC.
180 Degree hybrid design. Copper alloy contacts, brass shell.
Straight-pin DIP design. Brass/SUS shell, 1.5A current rating.
Four-layer stacked design. 2.80mm pitch, bent-pin termination.
Dual Type-C ports. 180 Degree orientation, brass shell.
Quad-port USB 3.0 AF connector. 1.8A power delivery per port.
Full-surface SMT design. Nickel-plated brass shell.
Four-layer architecture. SUS shell with fog-tin plating.