Triple-layer stackable design. Front-accessible Type-C ports.
High-density connector with BRASS contacts. Supports 10Gbps data transfer.
Shenzhen Gaorunxin Technology Co., Ltd
GEN2 protocol support. Straight pins, SUS shell.
0.60mm SMT height. Copper alloy contacts, brass shell.
GEN2 protocol, 3.40mm height. Forward bent-pin design.
6.15mm height with locking clip. SK7 shell, 30V rating.
Two-tone housing. 90 Degree bent pins, U2/U3 protocol support.
90 Degree double-layer design with 4 pins. 1.5A current, 30V DC, UL94-V0 housing.
180 Degree locking mechanism. 1.8A power delivery, SUS shell.
Rolled-edge + forked pins. Support-free design.
Double-to-single layer conversion. Raised base for thermal management.
IP-rated vertical Type-C. SUS shell, nickel plating.