Rolled-edge + forked pins. Support-free design.
Compact connector with 30m ohm contact resistance. Space-constrained PCB applications.
Shenzhen Gaorunxin Technology Co., Ltd
14.80mm height, rolled-edge. Copper alloy contacts.
GEN2 protocol support. Straight pins, SUS shell.
180 Degree locking mechanism. 1.8A power delivery, SUS shell.
Straight pins, flat-edge design. 10Gbps data transfer.
IP67-rated 180 Degree design. Copper alloy contacts, brass shell.
Four-layer architecture. SUS shell with fog-tin plating.
Long-body side-mount with bent pins. 30V DC, UL94-V0 housing.
2.80mm board-mount height. Reverse bent-pin design.
Triple-layer 90 Degree design with bent pins. 1.5A current rating, UL94-V0 compliant.
12.80mm pitch, 90 Degree double-layer design. 30V DC, 100V withstand voltage.