Reverse-mount double-layer design. 30V DC, 100V dielectric strength.
High-current connector with brass/SUS shell. -55 Degree C to 85 Degree C temperature range.
Shenzhen Gaorunxin Technology Co., Ltd
4.14mm height, reverse-mount design. No flange, brass shell.
Front-stackable design. Raised single layer, 10Gbps speed.
4.31mm board-mount depth. Forward orientation, bent pins.
Rolled-edge + forked pins. Support-free design.
2.80mm board-mount height. Reverse bent-pin design.
Rolled-edge reverse fork pins. U2/U3 contacts with selective plating.
Three-layer stacked design. Fog-tin plated contacts.
Straight-pin DIP design. Brass/SUS shell, 1.5A current rating.
0.5mm mount height, forward orientation. SUS shell.
Two-tone housing. 90 Degree bent pins, U2/U3 protocol support.