6.26mm height, straight pins. Copper alloy contacts.
Low-profile connector with 1.8A power delivery. Board-edge applications.
Shenzhen Gaorunxin Technology Co., Ltd
Front-stackable design. Raised single layer, 10Gbps speed.
13.70mm height (duplicate). UL94-V0 housing, 30V DC.
90 Degree double-layer design with 4 pins. 1.5A current, 30V DC, UL94-V0 housing.
GEN2 protocol. 90 Degree bent pins, nickel-plated SUS.
19.64mm length, rolled-edge + bent pins. Nickel-plated SUS.
Triple-layer fork-pin design. 1.5A current, 30m ohm contact resistance.
7A high-current, IP-rated. 16-pin Type-C, -40Degree C to 125Degree C.
Reverse-mount double-layer design. 30V DC, 100V dielectric strength.
GEN2 protocol, straight pins. Nickel-plated SUS shell.
Rolled-edge reverse fork pins. U2/U3 contacts with selective plating.