GEN2 protocol support. Straight pins, SUS shell.
High-speed connector with 10Gbps transfer rate. Industrial temperature range.
Shenzhen Gaorunxin Technology Co., Ltd
Straight-pin DIP design. Brass/SUS shell, 1.5A current rating.
2xU2 upper + 2xU3 lower layers. Fog-tin plated SUS shell.
3.36mm height, straight-pin forward mount. 30m?? contact resistance.
Three-port stacked design. Non-spring contacts, DIP termination.
Straight pins, flat-edge design. 10Gbps data transfer.
Rolled-edge + forked pins. Support feet, brass shell.
Unrolled-edge reverse orientation. 1.8A/0.25A contact configuration.
Double-to-single layer conversion. Raised base for thermal management.
GEN2 protocol, straight pins. Nickel-plated SUS shell.
Long-body side-mount with bent pins. 30V DC, UL94-V0 housing.