GEN2 protocol, straight pins. Nickel-plated SUS shell.
High-speed (10Gbps) connector. 100V withstand voltage, -55 Degree C to 85 Degree C range.
Shenzhen Gaorunxin Technology Co., Ltd
Double-to-single layer conversion. Raised base for thermal management.
Straight-pin DIP design. Brass/SUS shell, 1.5A current rating.
Forked pins with locking clip. 6.15mm height, 30V DC rating.
0.60mm SMT height. Copper alloy contacts, brass shell.
19.64mm length, rolled-edge + bent pins. Nickel-plated SUS.
7A high-current, IP-rated. 16-pin Type-C, -40Degree C to 125Degree C.
Bent-pin termination. U2/U3 contacts with separate plating.
9.50mm raised base. Nickel-plated brass shell.
Four-layer architecture. SUS shell with fog-tin plating.
Front-stackable design. Raised single layer, 10Gbps speed.