Three-layer stacked design. Fog-tin plated contacts.
High-capacity connector with 10Gbps speed. UL94-V0 compliant housing.
Shenzhen Gaorunxin Technology Co., Ltd
Dual Type-C ports. 180 Degree orientation, brass shell.
90 Degree double-layer design with 4 pins. 1.5A current, 30V DC, UL94-V0 housing.
Four-layer architecture. SUS shell with fog-tin plating.
Hybrid USB 3.0 + Type-C. 90 Degree orientation, nickel-plated SUS.
19.64mm length, rolled-edge + bent pins. Nickel-plated SUS.
19.64mm length, straight-edge + forked pins. SUS shell.
GEN2 protocol support. Straight pins, SUS shell.
Long-body side-mount with bent pins. 30V DC, UL94-V0 housing.
Triple-layer fork-pin design. 1.5A current, 30m ohm contact resistance.
Unrolled-edge forward fork pins. SUS shell with nickel plating.